電子科学株式会社

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2025〜

2026:論文・雑誌・本

1.Adhesion between a borophane sheet and a metal substrate by interface bonding

  • Kazuki Yamaguchi*1, Heming Yin*1, Masahito Niibe*1, Jingmin Tang*1*2, Masashige Miyamoto*1, Yuki Tsujikawa*1*3,
  • Haruto Sakurai*1, Yu Murano*1, Kenichi Ozawa*4*5, Masafumi Horio*1,Jun-ichi Yamaura*1, Takahiro Kondo*6*7, Iwao Matsuda*1

  • *1)Institute for Solid State Physics (ISSP), The University of Tokyo, Kashiwa, Chiba 277-8581, Japan
  • *2)International Center for Synchrotron Radiation Innovation Smart (SRIS), Tohoku University, Sendai, Miyagi 980-8572, Japan
  • *3)Department of Chemistry, Keio University, Yokohama, Kanagawa 223-8522, Japan
  • *4)Institute of Materials Structure Science, High Energy Accelerator Research Organization (KEK),Tsukuba, Ibaraki 305-0801, Japan
  • *5)The Graduate University for Advanced Studies (SOKENDAI), Tsukuba, Ibaraki 305-0801, Japan
  • *6)Tsukuba Institute for Advanced Research, University of Tsukuba, Tsukuba, Ibaraki 305-8573, Japan
  • *7)Institute of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Ibaraki 305-8573, Japan

  • Applied Surface Science Advances, 2026, 31: 100918. https://doi.org/10.1016/j.apsadv.2025.100918
  • This is an open access article under the CC BY license.

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